News Releases

October 20, 2026

High Density Packaging User Group Announces Nittobo Membership

High Density Packaging User Group (HDP) is pleased to announce that Nittobo has become a member. “We are honored to join HDP User Group and collaborate […]
October 15, 2026

High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method

High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the […]
March 4, 2026

Tony Senese Receives Ruben Bergman Award

Tony Senese received the Ruben Bergman Award at the HDP Member Meeting in March 2026, becoming the sixth recipient since the award’s establishment twelve years ago. […]
March 4, 2026

Brian Wright Receives Significant Contributor Award

Brian Wright received the Significant Contributor Award at the HDP Member Meeting in March 2026 for his exceptionally outstanding contributions to the Final Finish Layer Deposits […]
November 25, 2025

High Density Packaging User Group Announces European Space Agency Membership

High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member. “I’m excited for the opportunity to […]