Name: Sequential Lamination Mtg
Start: 2024-05-15T10:00:00-05:00
End: 2024-05-15T11:00:00-05:00

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Sequential Lamination Mtg

May 15 @ 10:00 am - 11:00 am CDT

« Effects of Plating Thickness on CTF at IST Phase 2 Project Call
NEW PROJECT – Outer Trace Adhesion »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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